SAN JOSE, Calif. -- Oclaro, Inc. (NASDAQ: OCLR), a tier-one provider and innovator of optical communications and laser solutions, and 3SPGroup, a leading provider of innovative optical products and solutions for lasers, sensors and telecommunications markets, today announced the establishment of a new Multi-Source Agreement (MSA) that defines a new industry-standard Small Form Factor (SFF) pump laser package. This new industry standard will enable customers to design amplifiers based on MSA pump laser devices in a compact 10-pin butterfly package that is approximately 30% the size of the legacy 14-pin format package.

The new 10-pin butterfly package represents a significant advancement in pump laser packaging. The current standard for packaging is based on a 14-pin format that has changed little over the last 15 years. As the driving forces behind the new 10-pin butterfly MSA standard, both Oclaro and 3SPGroup are enabling their customers to develop exciting, market-leading compact amplifiers with lower costs and reduced space requirement in network equipment. In addition, by offering compatibility with the MSA, Oclaro and 3SPGroup can ensure next generation pump lasers meet a defined and agreed mechanical outline, footprint and electrical pin-out. This is extremely important to amplifier customers who would otherwise have to deal with many different formats and form factors from their pump vendors.

Oclaro Inc. (Nasdaq: OCLR)