OIF Tackles TDM-P
The TDM-P Implementation Agreement, created by the OIF's Physical Link Layer (PLL) Working Group, aggregates multiple TDM Fabric to Framer (TFI-5) signals into higher rates (x2, x4), like those identified in the Common Electrical Interface (CEI) and CEI Protocol (CEI-P) specifications. Providing a TDM protocol solution for higher data rates enables systems to support higher data throughput within the same physical space. Higher levels of integration traditionally lead to more cost effective and efficient operation.
A new project from the NPF, Serial Look-Aside (SLA), was adopted and initiated as a project by the OIF. SLA interface will be an upgrade to the widely adopted Look-Aside Interface (LA-1) between network processing elements and co-processors such as Network Search Engines (NSE).
Another NPF project, the Scalable Streaming Packet Interface (SPI-S), was sent to OIF membership to begin review and approval. SPI-S is intended to be a serialized upgrade to the OIF's industry-leading Serial Packet Interface (SPI-4.2). The SPI-S draft uses the existing CEI and CEI-P specifications.
"Both of these projects are important upgrades to leading industry interfaces for two different applications," said Harmeet Bhugra of Integrated Device Technology, and a member of the NPF board of directors. "It is natural to start the approval process for SPI-S within the OIF, as SPI-S is intended to be an upgrade to the existing OIF SPI-4.2 interface."
Optical Internetworking Forum (OIF)