S3 Offers WLAN IC IPS3 Offers WLAN IC IP

DUBLIN -- Silicon & Software Systems (S3), a leading supplier of mixed signal circuit solutions, today announced the availability of a range of IP for the analog front-end section of IEEE802.11a/b/g ICs. This IP is silicon-proven on TSMC's 0.18um CMOS process and has been characterized for applications in the multi-band WLAN market.

In a highly competitive market such as the WLAN chip sector, IC designers are facing schedules of less than 12 weeks from specification to tape-out including full chip integration. Many are turning to specialist design houses, such as S3, for fully characterized silicon upon which to base their designs. S3's IP can be delivered in matched "I&Q" pair configurations - ensuring minimum chip finishing requirements.

"Our customers are keen to use S3's IP to accelerate their chip integration and design cycle times," said Bob Tait, Product Marketing Manager at S3. "Using S3's IP removes significant risk from 802.11 WLAN product developments. This allows valuable engineering effort to be focused on clear differentiation in the system product design."

S3's portfolio of mixed signal IP includes 10 bit pipeline ADCs up to 80 MSPS and DACs up to 200MSPS with supporting PLL and reference circuits.

S3 will present their complete mixed signal portfolio at the TSMC Europe Technology Symposium, Brussels, on September 23rd next.

Silicon & Software Systems Ltd. (S3)