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Renesas Technology embeds Access IrFront v2.1 in a single-chip LSI to provide 4-Mbit/s infrared communications for FOMA handsets
November 17, 2005
TOKYO -- ACCESS Co., Ltd., (TOKYO:4813), a global provider of mobile content delivery and Internet access technologies and Renesas Technology Corp., a world-leading semiconductor company providing system solutions, today announced that they have partnered to provide a 4Mbps infrared communications solution for mobile handsets. The solution will consist of a baseband and an application processor as a single-chip LSI, developed jointly by Renesas Technology and NTT DoCoMo for FOMA handsets, embedded with ACCESS' infrared communication protocol stack IrFront v2.1.
In order to drive adoption of FOMA handsets in global markets, Renesas Technology partnered with NTT DoCoMo in July 2004 to develop a dual-mode single-chip LSI compatible with both the W-CDMA (3G) and GSM/GPRS (2G) standards.
ACCESS' infrared protocol stack IrFront v2.1 together with Renesas Technology's single-chip LSI, will increase the infrared personal area network (PAN) transmission speed of FOMA mobile handsets from 115 kbps to 4 Mbps. As a result, users will be able to transmit data at four to 10 times the speed of the infrared on existing FOMA handsets. This means users will be able to send large volumes of graphical data or even entire address books in a single transmission.
In addition, because IrFront v2.1 will be compatible with IrSimple, a global standard aimed at increasing infrared-based data transmission speeds, users can expect even higher transmission speeds in the future. ACCESS plans to announce an IrSimple-compatible version on January of 2006.
Renesas Technology and ACCESS will collaborate on the adoption of FOMA and 3G mobile handsets from the infrared communications development stage, as well as the promotion and support of these standards.
"This LSI integrates the dual baseband for W-CDMA and GSM/GPRS communications and application processor SH-Mobile in a single-chip, and with clock frequencies of 312MHz, enabling such advanced features as 5M pixel cameras, TV output and video telephony," said Hideo Inayoshi, senior vice president of Renesas Technology. "The chip delivers the benefits of lower cost as well as lower power consumption. By embedding IrFront, which has a track record of success and a superb reputation in the market, we can now enable 4 Mbps infrared communications and deliver an even more attractive single-chip solution to the market."
"We are pleased that ACCESS' IrFront has been adopted in Renesas Technology's LSI," said Toru Arakawa, president and CEO of ACCESS. "By combining our technologies, mobile users will be able to transmit data leveraging high speed infrared communications and benefit from a great mobile experience."
Renesas Technology Corp.
Access Co. Ltd.
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