Moto Gets Smart

Motorola unveils Smart Baseband Solutions for wireless infrastructure; improves RF transistor performance for CDMA, GSM, and EDGE gear

June 5, 2003

4 Min Read

PARIS -- SMART NETWORKS DEVELOPER FORUM -- Wireless infrastructure vendors face multiple challenges--from intense cost pressures to rapidly evolving standards to significant R&D risks--in their quest to deliver base station platforms for next-generation wireless networks. Motorola (NYSE:MOT) helps them meet these challenges with its Smart Baseband Solutions, a comprehensive, system-level baseband processing architecture designed for 2.5G and 3G base stations. Motorola's MRC6011 Reconfigurable Compute Fabric (RCF) device and next-generation MSC8126 multicore StarCore® digital signal processor (DSP), in concert with Motorola wireless application software library modules, offer the underlying silicon and software technology for Motorola's Smart Baseband Solutions.

The MRC6011 RCF device is engineered to provide an efficient processing solution for a wide range of computationally intensive applications, such as baseband processing for 3G and broadband wireless access systems. Working in tandem with Motorola's MSC8126 StarCore DSP, the MRC6011 RCF device is designed to enable system architects to adapt algorithms and fix bugs before and after deployment, fine-tune baseband architecture and manage partition and load on the fly, design multi-standard wireless platforms, and add advanced capabilities, such as adaptive antenna (AA) and multi-user detection.

Motorola's Smart Baseband Solutions offer the advanced RCF and DSP components, along with library modules and development tools, required to develop scalable and programmable baseband processing systems that accommodate multiple standards, such as Wideband Code Division Multiple Access (WCDMA), Code Division Multiple Access 2000 (CDMA2000), Time Division-Synchronous Code Division Multiple Access (TD-SCDMA) and Enhanced Data rates for GSM Evolution (EDGE). Smart Baseband technology supports system-level flexibility, a consistent design environment for the entire baseband and efficient C and assembly programming. In addition, the technology is based on optimized processor-application mapping to increase capacity, deliver high performance and maintain low-power dissipation per channel.

“RCF technology provides a programmable alternative to more costly ASIC- and FPGA-based baseband system designs,” said Will Strauss, president of Forward Concepts. “Today's wireless infrastructure market is undergoing a rapid transition toward 3G technology. During this transition, base station vendors require baseband processing solutions that will help reduce R&D and deployment costs as well as ongoing cost of ownership. RCF is an exciting new approach to meeting these needs and promises to play a prominent role in shaping the future of wireless infrastructure.”

“Motorola's Smart Baseband Solutions are designed to provide a flexible, future-proof reconfigurable compute fabric, enabling manufacturers to reduce the total cost and complexity of wireless infrastructure equipment, adapt to evolving wireless standards around the world, and speed time to market,” said David Perkins, corporate vice president and general manager of Motorola's Networking and Computing Systems Group. “Motorola is driving the future of high-performance, multicore RCF and DSP technology for the benefit of our wireless base station customers. Motorola's MRC6011 device represents a giant step toward our goal of providing groundbreaking silicon solutions for 3G baseband processing.”In a separate release:

The industry's first 100W, 900MHz RF power transistors in plastic packaging are now available from Motorola, Inc. (NYSE:MOT). Expanding its portfolio of industry-leading RF semiconductor solutions for the wireless infrastructure market, Motorola's latest generation of RF power transistors is designed to enhance power capabilities, efficiency and ease-of-use for 900MHz cellular base station power amplifiers applications. Additionally, designers and equipment manufacturers can expect to benefit from manufacturing and system cost savings through higher yields and production margins.

The newest generation 900MHz product portfolio (900G3) leverages the performance advantages of Motorola's fifth generation RF LDMOS (Laterally Diffused Metal Oxide Silicon) die technology and offers several key advantages to aid designers in producing world-class amplifiers. Advantages include a 4 to 5 percentage point increase in efficiency over previous generations, higher output power capability, and up to 20 percent improvement in thermal resistance when compared to standard ceramic packaging.

"Motorola is extremely sensitive to the cost reduction requirements being placed on our customers," said Lynelle McKay, vice president and general manager of Motorola's RF & DSP Infrastructure Division. "We continue to expand our RF plastic portfolio to offer exceptional performance, while enabling our customers to benefit from savings in manufacturing and overall system cost reductions."

Examples of the 900G3 family include:

  • MRF5S9100M -- The industry's first 100W, 900MHz RF power transistor available in plastic packaging. The MRF5S9100M is designed for CDMA applications, and demonstrates typical performances of 17dB gain, 23W average output power and 30 percent efficiency at -45dBc ACP (adjacent channel power).

  • MRF5S9101M -- 100W 900MHz plastic RF power transistor is optimized for GSM and GSM EDGE applications. The device offers typical performance of 17dB gain, 50W output power and 40 percent efficiency under EDGE conditions.

Both devices are available in the newest additions to Motorola's family of high-power RF plastic packages--the TO270 and TO272 wide body. Motorola now offers 900MHz plastic RF power devices with output power levels from 2W to 100W, offering designers more flexibility and cost saving potential.

Motorola Inc.

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