PRINCETON, N.J. -- Lamina Ceramics, Inc., which employs proprietary technology to bond unfired ceramic to metal for use in communications and electronic components and packaging, announced today that it has obtained $12-million in venture capital funding. The funding comes from Morgenthaler, a national venture capital firm with many investments in wireless and optical communications, as well as from a major communications systems vendor. Sarnoff Corporation, the technology development firm that invented the bonding process, is also a major equity partner in Lamina.Taylor Adair, Lamina's CEO, calls the company's technology "a Swiss army knife for solving next generation electrical and mechanical design problems.” Bonded-ceramic-on-metal, he says, offers component and packaging customers a tool with multiple advantages over conventional technology that helps them significantly reduce size and system costs while greatly raising performance.Lamina Ceramics Inc.