SINGAPORE -- Singapore-based DenseLight Semiconductors (“DenseLight”) today announces that it has secured a two-year R&D project that is worth several millions of dollars to further develop its strong proprietary technologies in photonics and high-speed communications products. DenseLight, with its initial US$30 million funding, has been able to develop robust, high-performance products with multiple functionalities in small footprints that address the sub-component and component levels, drastically reducing cost of ownership for network operators. The company has already announced its DensePIC technology, which has been cited as “a surprise to the optical component industry”. The DensePIC technology is based on quantum-well intermixing (QWI), a technique for altering the band-gap of a semiconductor so that it can emit or absorb light at a different wavelength. Currently, most methods for creating multiple sections on a single chip have been techniques such as growth and regrowth, and selective area epitaxy, which typically require more process steps and longer cycle times. Through its in-house developed techniques, DenseLight’s QWI process is able to engineer different bandgaps in a single process sequence, significantly reducing production cycles and increasing the yields and reliability of the products. In the coming OFC 2002 in March 19-21, DenseLight will showcase its broad range of photonic chips, embedded Optical Channel Monitors (OCMs) with passive and active functionalities integrated on a single InP chip, and Superluminescent Light Emitting Diodes (SLEDs) for telecommunications and biomedical applications. Although details of the multi-million dollar project remain confidential, DenseLight is proud to reveal that many of these products that will be showcased in OFC 2002 attest to their initial success in implementing the two-year R&D project. DenseLight Semiconductors Pte. Ltd.