Qualcomm accelerates availability of low-end UMTS/HSDPA chipsets

May 8, 2006

1 Min Read

SAN DIEGO -- QUALCOMM Incorporated (Nasdaq: QCOM), a leading developer and innovator of Code Division Multiple Access (CDMA) and other advanced wireless technologies, today announced that it will be sampling three of its UMTS solutions ahead of schedule in order to enable the quicker delivery of affordable and compelling 3G handsets to the UMTS market. The sampling date for the Mobile Station Modem(TM) (MSM(TM)) MSM6245(TM) chipset for entry-level WCDMA/EDGE/GPRS/GSM (WEDGE) devices, MSM6255A(TM) chipset for mainstream multimedia WEDGE devices and the MSM6260(TM) chipset for highly cost-efficient HSDPA devices supporting 3.6 Mbps data rates has been brought forward to May of 2006. The early sampling of the family of integrated solutions will help enable the proliferation of mass-market UMTS devices, driving the migration of 2G wireless users to 3G and extending the Company's technology leadership by bringing HSDPA to mainstream markets.

"QUALCOMM remains committed to ensuring its manufacturing partners' success by delivering a competitive time-to-market advantage, especially to the entry-level and mid-tier markets which are so essential to driving the overall migration of subscribers to 3G," said Alex Katouzian, senior director of product management for QUALCOMM CDMA Technologies. "The early sampling of this family of cost-efficient WCDMA and HSDPA chipsets demonstrates our continuing excellence in delivering next-generation technology."

The Value Platform MSM6245 chipset and Multimedia Platform MSM6255A and MSM6260 chipsets, are part of QUALCOMM's segmented roadmap offering complete coverage of all market tiers. The three solutions leverage 65nm process technology and are also software API-, RF- and pin-compatible to offer handset manufacturers shortened design cycles and reduced development costs by allowing the leveraging of a common chipset platform for multiple device designs.

Qualcomm Inc. (Nasdaq: QCOM)

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