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March 21, 2005
BRISTOL, U.K. -- Icera, the new cellular wireless semiconductor company, today announced the appointment of Rick Dingle as Vice President Platforms. Dingle, who was previously CTO at Siemens Mobile Phones, will lead Icera’s strategic platform development for cellular devices and further strengthen the management team as it prepares to introduce breakthrough processor and software baseband technology products to the mobile industry.
“Rick’s telecoms industry experience speaks for itself; at Siemens he brought over 50 mobile phones to market and managed the entire mobile R&D team globally. He has great insight into the issues facing mobile device manufacturers, strong relationships within the OEM industry and is the ideal person to establish Icera as a major cellular communications platform provider,” said Stan Boland, Icera President and CEO.
“I have been watching Icera for some time with great interest,” said Rick Dingle. “The company has real potential to become a global market leader. Icera has an incredibly strong team, a breakthrough technology and a clear strategy: to adopt a segmented approach to the market and to deliver compelling platform solutions with a low cost of ownership and implementation for mobile device manufacturers.”
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