I have read ALL of the published papers. And have seen inside a PIC module.
so I ask you a few direct questions:
1) does IFN make all the parts inside a PIC on a single inP die? Or
2) do they make separate die for the transmit and receive functions and co-package them?
3) what dies do they use for the optical mux / demux functions? are those monolithically done in InP and on the SAME die as the TX and RX chips?
4) do they not use any lenses and other bulk optics parts inside the PIC?
easy way to prove I am wrong. Just show us the inside of a PIC. Note: showing us the inside will not give away much in the way of key intellectual property. If indeed it is monolithically done, it would be virtually impossible to copy any IP based on a photo of the inside of the package.
Thanks for the link. It is interesting stuff.
So it looks like INFN has ten transmitters spaced 200 GHz apart on each chip. The outputs from four such chips (with slight wavelength difference) are combined together into one fiber to cover the enire C-band.
Dear SLUT,
I have read ALL of the published papers. And have seen inside a PIC module.
so I ask you a few direct questions:
1) does IFN make all the parts inside a PIC on a single inP die? Or
2) do they make separate die for the transmit and receive functions and co-package them?
3) what dies do they use for the optical mux / demux functions? are those monolithically done in InP and on the SAME die as the TX and RX chips?
4) do they not use any lenses and other bulk optics parts inside the PIC?
easy way to prove I am wrong. Just show us the inside of a PIC. Note: showing us the inside will not give away much in the way of key intellectual property. If indeed it is monolithically done, it would be virtually impossible to copy any IP based on a photo of the inside of the package.
sailboat