SUNNYVALE, Calif. -- MegaSense Inc., a pioneer of integrated photonic micro-modules and micro-subsystems, announced today it has established a state-of-the-art MEMS wafer fabrication facility and has been awarded its first patent that covers broad MEMS wafer-level packaging processes. The completion of the fab, located at the company's headquarters in Sunnyvale, Calif., is a critical step in the company's strategy to independently produce its products, a key requirement for telecommunications customers. This patent and MegaSense's patent-pending portfolio cover a growing technology platform, based on the company's proven System Approach to commercializing MEMS. The System Approach was developed and refined through decades of successful commercial manufacturing of MEMS products in high volume by Dr. Vladimir Vaganov, MegaSense's founder and chief executive officer. The MegaSense executive team, fab, and intellectual property position the company as a leading provider of advanced photonics modules and subsystems, which allow the orders-of-magnitude cost reductions traditionally ascribed to the semiconductor industry. With $10 million in funding from Bay Partners and TPG Ventures, an executive team that possesses more than 75 years of experience in the commercialization of high-volume MEMS, photonics and electronics products, and a team named in nearly 100 patents, MegaSense is poised to play a defining role in establishing a new era of photonics. MegaSense, Inc.