SANTA CLARA, Calif. -- Intel Corporation today announced the availability of new carrier-grade telecommunications boards based on embedded Intel® processors. The new boards help telecom equipment manufacturers (TEMs) move from closed, proprietary systems to standards-based modular communications platforms.The Intel® NetStructure(tm) telecom boards can be used as part of a high-density modular communications platform solution that will enable TEMs to focus on value-add competencies such as application development and network systems integration.Intel introduced three new communications boards compliant with version 2.16 of the PCI Industrial Manufacturers Group's* (PICMG) Compact PCI* form factor standard. These boards provide an economical, scalable path for TEMs to develop IP-based modular network and communications applications including web servers, mail servers, cache servers, VPN switches, media gateways, 2.5G and 3G wireless base stations, server clusters, DSL access multiplexers and voice/video/data servers."Because we used standards-based communications building blocks from Intel, we were able to quickly and easily develop our IPC 3.1, a carrier grade IP-based audio/video and data conferencing solution at significantly lower cost and much faster time-to-market," said James Mi, vice president of marketing and business development for iTelco Communications. "By offering standards-based products, Intel is simplifying the development process and providing an economical, scalable path for new modular communication solutions."The new communication boards include:

To meet the needs of carrier-grade modular network applications such as media servers, media gateways and enhanced programmable switches, Intel has also developed new high-density CompactPCI media processing and network interface boards.The new media processing and network interface boards include:

Intel Corp.