MUNICH and BARCELONA, Spain -- Infineon Technologies AG (FSE/NYSE: IFX) today, at the 3GSM World Congress in Barcelona, announced sample availability of its latest baseband processor supporting HSDPA (High-Speed Downlink Packet Access) data rates of up to 7.2 megabits per second (Mbit/s). The chip’s high integration level enables Infineon to be the first semiconductor supplier to offer such HSDPA data rates for the mid-range multimedia phone segment.

The new S-GOLD3H chip is the latest addition to Infineon’s renowned S-GOLD® baseband processor family. It expands the company’s portfolio of HSDPA mobile phone solutions, which now includes baseband processor, radio frequency transceiver, power management IC, protocol stack and APOXI application framework. The S-GOLD3H is the heart of Infineon’s next-generation HSDPA / WCDMA / EDGE multimedia reference platform, the MP-EH.

“Infineon strives for innovative integration of functionalities into its chips to provide our customers with a wide range of reference platforms designed for all segments of the mobile industry, from ultra-low-cost phones to feature phones, including technology ranging from 2G, or second generation, to 3.5G. Our new HSDPA chip enables more than triple the data rates possible in mass market phones today. This makes broadband multimedia applications, such as video streaming or high-speed audio/ video download, available to the mass market,” said Professor Dr. Hermann Eul, Member of the Board and head of the Communication Solutions business group at Infineon Technologies AG. “The scalability, versatility and completeness of our latest reference design platform enable our customers to meet extremely challenging time-to-market requirements when evolving from 2.75G phones to 3G and 3.5G phones, while being flexible enough to quickly adapt to changing markets.”

In a separate release:

MUNICH and BARCELONA, Spain -- The latest chip from Infineon Technologies AG (FSE/NYSE: IFX) reduces the number of electronic components in a basic mobile phone from about 100 to fewer than 50. In addition to providing the user the basic ability to make telephone calls and send and receive SMS (Short Message Service) messages, it also supports playback of polyphonic ringtones. Infineon’s E-GOLDvoice™ single-chip solution combines a baseband processor, radio frequency transceiver, power management unit and RAM in a footprint measuring just 8 mm x 8 mm, achieving a new record level of silicon integration for mobile communications. Until now, these components were several separate chips that occupied roughly double the area of the E-GOLDvoice chip.

The E-GOLDvoice chip is the heart of Infineon’s second generation platform for ultra low-cost handsets, ULC2. This platform can lower the bill-of-material costs for an ultra low-cost mobile phone by approximately 20 percent, from about US $20 using a currently available Infineon platform to below US $16. Included in these costs are the complete telephone with all its electronic components, printed circuit board, connectors, casing with keypad and display, all software components, rechargeable batteries, charger, packaging, and operating manual.

E-GOLDvoice, the most highly integrated GSM chip available today, shrinks the space required for the electronics in a mobile handset to just four square centimeters. This extends Infineon’s lead in shrinking the chip size and component requirements for GSM phones. The company introduced a first-generation platform in 2005 that fits into a mere nine square centimeters and is due to appear in ultra low-cost handsets in the middle of 2006.

Infineon Technologies AG (NYSE/Frankfurt: IFX)