LONDONDERRY, N.H. -- NanoVia, LP announces the licensing of its hybrid optical technology for laser microvia drilling to Hitachi Via Mechanics, Japan. This announcement marks the culmination of several program milestones for NanoVia, LP, which included a direct investment by Hitachi Via Mechanics, a four-year exclusive license and the delivery of several optical sub-systems for future Hitachi products. All of the technology being licensed is patented or patent pending.NanoVia began its relationship with Hitachi Via Mechanics in fiscal year 2000 after presenting its latest laser microvia grid array system at the2000 IPC show. The natural synergy between the two organizations hasallowed the two groups to develop next generation products for the high-density packaging market.The microvia drilling technology can increase throughput of standard systems by a factor of 2X and current R&D optical designs, which show capabilities of greater than 4X. The technology is optimized for grid array style packaging for chip packaging applications.“The HDI marketplace needs long term strategies for developing process technology that ensures yields, increases throughput and provides a good return on investment”, explains Todd Lizotte, VP of R&D at NanoVia, LP,” Our partnership with Hitachi Via Mechanics is a testament to Hitachi’s dedication to that philosophy.”NanoVia LPHitachi Via Mechanics Ltd.