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Ethernet equipment

CE Access Platform Market Booming

3:00 PM -- Research for Heavy Reading’s newest "Carrier Ethernet Access Platform (CEAP) Quarterly Market Tracker" indicates the CEAP market grew at a healthy 12 percent between the first and second quarters of 2009 to $235 million and appears to be on track for a solid performance in the second half. Worldwide sales of CEAP platforms were up 17 percent year-over-year to $935 million in the rolling four-quarter period ending in the second quarter.

The CEAP market is growing even during the economic downturn because hundreds of operators and other entities worldwide are purchasing CEAPs to support several of the fastest growing telecom services and applications. These include Ethernet business services, consumer triple-play services and applications (including DSLAM backhaul), and cellular/WiMax backhaul applications.

CEAP products examined by Heavy Reading include Ethernet over fiber demarcation platforms and access switches, Ethernet over bonded copper pair solutions, and Ethernet over TDM access circuit products. Many of the key suppliers of CEAP platforms and other Ethernet-related access solutions will be highlighting the latest updates to their product portfolios at Ethernet Expo Americas 2009 in New York City on Tuesday and Wednesday, November 3 and 4.

All three CEAP product categories posted sequential growth in this year's second quarter. Ethernet over fiber access platform sales grew most rapidly the second quarter or 2009 and were up nearly 14 percent quarter-over-quarter. The Ethernet over bonded copper pair platform market grew 9 percent sequentially, while the Ethernet over TDM access platform market was up 2 percent.

Heavy Reading estimates Huawei led the Ethernet over fiber access platform market segment with a 14 percent share in the quarter. Telco Systems, Cisco, ADVA, and MRV rounded out the top five Ethernet over fiber access platform vendors. Ciena posted the largest share gain among established suppliers.

Hatteras maintained a commanding lead of the Ethernet over fiber bonded copper pair platform segment after posting another quarter of sequential growth. No. 2 Adtran and No. 3 Actelis also reported forward progress in the quarter. Other Ethernet over bonded copper pair platform suppliers with notable shares include RAD, NexComm, Positron, and Zhone.

Overture Networks gained several share points and maintained its solid No. 1 position in the competitive Ethernet over TDM access circuit market. ANDA edged out RAD for the No. 2 spot. Other suppliers include ADVA and nearly a dozen additional vendors with small market share.

On November 4, Heavy Reading will host an invitation-only "Carrier Ethernet for Investors Breakfast Session" at Ethernet Expo that will cover the latest trends related to carrier Ethernet business services, mobile backhaul services, and carrier Ethernet network solutions -- including CEAPs, switches/routers, and packet-optical transport platforms. Our special guest, Michael Genovese, Principal Analyst, Soleil Securities/Elevate Research, will share his views on "Why Carrier Ethernet Should Matter to Investors." Financial analysts and investors with questions on the CEAP and other Ethernet markets definitely should plan to attend.

— Stan “EtherMan” Hubbard, Senior Analyst, Heavy Reading

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