10-Gigabit Ethernet

During 2001 semiconductor companies started rolling out 10-Gigabit Ethernet products. Devices available now include:
The first 10-Gigabit Ethernet systems used either proprietary optical modules or transponders conforming to the 300-pin MSA (multisource agreement). These are relatively large and expensive modules initially developed to support Sonet/SDH.
The recent introduction of Xenpak transponders is a significant step towards expanding the 10-Gig Ethernet market. There are seven companies now shipping, or planning to ship these transponders:
The first systems with Xenpak transponders are now entering the market. Future cost reductions will be driven by the introduction of even smaller transponders based on the XPAK, X2, and XFP MSAs.
XPAK and X2 transponders use the same XAUI interface as Xenpak, but will also support 10-Gigabit Fiber Channel. XPAK and X2 transponders are 40 percent smaller than Xenpak transponders. The XPAK and X2 MSAs are very similar, and it is unclear at the moment which will be more widely used (see The X-Wars: Agilent Strikes First).
XFP transceivers, that integrate a new serial interface (XFI), will further reduce system cost. They have a very small footprint and will support 10-Gigabit Fiber Channel and 10-Gbit/s Sonet/SDH as well as 10-Gigabit Ethernet (see XFP Module Group Debuts Spec).
- Discrete media access controllers (MAC)
- Physical layer devices (PHY)
- Sonet/SDH framer/mapper devices
- Gigabit Ethernet switch devices with integrated 10-Gig Ethernet MACs
The first 10-Gigabit Ethernet systems used either proprietary optical modules or transponders conforming to the 300-pin MSA (multisource agreement). These are relatively large and expensive modules initially developed to support Sonet/SDH.
The recent introduction of Xenpak transponders is a significant step towards expanding the 10-Gig Ethernet market. There are seven companies now shipping, or planning to ship these transponders:
-
In production
- Agilent Technologies Inc. (NYSE: A)
- JDS Uniphase Corp. (Nasdaq: JDSU; Toronto: JDU)
- Molex Inc. (Nasdaq: MOLX/MOLXA)
- Intel Corp. (Nasdaq: INTC)
- Optillion AB
- OpNext Inc.
- Infineon Technologies AG (NYSE/Frankfurt: IFX)
- TriQuint Semiconductor Inc. (Nasdaq: TQNT)
The first systems with Xenpak transponders are now entering the market. Future cost reductions will be driven by the introduction of even smaller transponders based on the XPAK, X2, and XFP MSAs.
XPAK and X2 transponders use the same XAUI interface as Xenpak, but will also support 10-Gigabit Fiber Channel. XPAK and X2 transponders are 40 percent smaller than Xenpak transponders. The XPAK and X2 MSAs are very similar, and it is unclear at the moment which will be more widely used (see The X-Wars: Agilent Strikes First).
XFP transceivers, that integrate a new serial interface (XFI), will further reduce system cost. They have a very small footprint and will support 10-Gigabit Fiber Channel and 10-Gbit/s Sonet/SDH as well as 10-Gigabit Ethernet (see XFP Module Group Debuts Spec).
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