FREMONT, Calif. -- Elma Electronic Inc., a global manufacturer of electronic packaging products announced a 13U AdvancedTCA chassis in the 23"size for European Telecommunications Standards Institute (ETSI) applications. The unit features a 16-slot full mesh backplane and superior cooling performance that has been optimized through thermal simulation.

The 13U ATCA chassis features a front-to-rear cooling configuration. Dual redundant shelf managers are pluggable in the card cage, without sacrificing any of the 16 slots. Elma's IPM Sentry shelf manager or others in the industry such as Intel's Colorado Springs unit can be used. The 13U height offers more space for airflow than 12U versions. Dual fan trays have 4x 150CFM fans below the card cage. There are also fan trays above the card cage with 1x fans for additional cooling. All of the fans have PWM input/Tach output capability. There are also separately removable air filters.

Other features of the 13U ETSI ATCA include a cable management bracket in the front of the chassis, dual RJ-45 jacks in the rear, and honeycomb air filter for intake and exhaust. The backplane has been optimized via signal integrity studies. Thermal simulation and testing confirms superior cooling for the chassis design.

Elma Electronic Inc.