Broadcom’s PON Chips
Broadcom is entering the PON chip market and has secured design wins with a major tier-1 equipment vendor. While this is something predicted here, the timetable was sooner than expected. This will have a substantial impact on FTTH component and equipment suppliers as well as the carrier currently conducting lab trials with the device.
Discussion with a number of industry participants revealed an unannounced Broadcom GPON program in advanced stages of development, with a design win at Alcatel-Lucent, the upcoming primary supplier of Verizon’s FiOS hardware as the carrier transitions away from BPON.
Broadcom designed the device internally despite a lack of active involvement in FSAN, the carrier-run group responsible for GPON interoperability that leads the ITU standards body. The device was first prototyped in an FPGA and the company now has silicon samples destined for testing in Alcatel equipment as well as Verizon carrier labs. Target deployment is 2H2009.
The chip includes the MOCA transceiver (revision 1.1) functions required by Verizon and currently supplied by Entropic in a standalone device. Broadcom is not doing the central office (OLT) chip and is initially focusing on a highly integrated gateway device for the customer location that displaces the standalone router and optical ONU terminal.
Read the full story at the Nyquist Capital Website.
— Andrew Schmitt, Nyquist Capital