SUNNYVALE, Calif. -- DigiLens, Inc. has developed an active planar waveguide technology that enables the creation of ultra-compact photonic chips for the telecommunications industry that consume 99% less power than competing technologies and exhibit low thermal emission. The company will demonstrate this technology in a multi-channel variable optic attenuator (VOA), at the Optical Fiber Conference, booth 3380, March 19-21, 2001 in Anaheim California.

"Our technology platform allows us to deliver feature-rich, integrated optical functionality in tiny planar waveguide circuits," said Jonathan Waldern, president and CEO of DigiLens. "The components derived from this technology offer telecommunication system integrators a dramatic reduction in size, power and heat dissipation, providing them with a more scalable solution than integrated thermo-optic-based active optical components."

http://www.digilens.com