CAMARILLO, Calif. -- Semtech Corp. (Nasdaq: SMTC), a leading supplier of analog and mixed-signal semiconductors, today announced it is working with IBM Corp. and its innovative 3D through-silicon via (TSV) technology to develop a high-performance ADC/DSP platform that has applications in fiber optic telecommunications, high performance RF sampling and filtering, test equipment and instrumentation, and sub-array processing for phased array radar systems.

Integration of high-performance data converters with advanced digital signal processing has traditionally been a difficult problem due to mixed IC technology requirements, management of chip-to-chip interconnect with high density, high power and high bandwidth and limited options for high-reliability multi-chip packaging with excellent thermal management. Numerous emerging applications may be significantly cost-reduced, and other new applications enabled, if ultra high performance data converters and/or RF transceivers constructed in the most advanced RF-optimized technologies can be efficiently married into a single package, along with highly-integrated application-specific digital processing constructed in the latest ultra-fine geometry CMOS technologies.

“Our strategic partnership with IBM is enabling Semtech and our leading-edge customers to define and develop a unique and versatile integrated ADC/DSP platform, applicable to multiple highly demanding system applications,” said David Clark, Vice President of Microwave & Millimeter-wave Products at Semtech Corporation. “Further, this first-generation 3D multi-chip module will validate key building blocks that will enable the accelerated time-to-market of future products with unique DSP content for specialized applications.

Semtech Corp. (Nasdaq: SMTC)