BEAVERTON, Ore. -- Chipset manufacturers will have their first major opportunity to test the interoperability of their products for the new G.hn home networking standard. The event will take place from May 23-27, 2011 and will be hosted at the ITU facilities in Geneva, Switzerland. The G.hn Chipset Interoperability Plugfest is a joint effort by the HomeGrid Forum and the Broadband Forum, and is being facilitated by the University of New Hampshire InterOperability Laboratory (UNH-IOL).

"As one of the world's leading organizations for broadband best practices and technology evolution, we are pleased to be able to co-host the first G.hn chipset open interoperability event. This is a very important step on the road to bringing G.hn products to the market and represents a significant milestone for service providers planning to deploy G.hn," said Robin Mersh, CEO of the Broadband Forum.

This G.hn open interoperability event represents a major advance in the efforts of the industry as it is the first of its kind. Together, HomeGrid Forum, Broadband Forum and ITU are taking a major step forward to accelerate the delivery of G.hn technology to the marketplace. Members of the Broadband Forum and HomeGrid Forum will be able to submit their chipsets for interoperability testing against the Interoperability Test Plan, which defines a suite of physical-layer and data-link-layer interoperability tests for G.hn.

"The ITU supports this event and we believe this represents a significant milestone in the world's service providers aligning around G.hn," said Malcolm Johnson, Director of the ITU Telecommunication Standardization Bureau from ITU. "A multi-vendor silicon interoperability event furthers the technology, and with the support of the Broadband Forum and HomeGrid Forum members, we are working with important players that will be deploying this technology in the near future."

HomeGrid Forum

Broadband Forum