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Broadcom Chip Bonds With 3D, MoCA 1.1

SCTE Expo Broadcom announced new set-top box system-on-a-chip solutions

October 27, 2009

1 Min Read

DENVER -- SCTE Expo Broadcom Corporation (Nasdaq: BRCM), a global leader in semiconductors for wired and wireless communications, today announced new set-top box (STB) system-on-a-chip (SoC) solutions enabling manufacturers and cable service providers to cost effectively offer the latest in interactive HDTV programming, connectivity, whole-home media distribution and advanced 3D user interfaces to the North American market. The new Multimedia over Coax Alliance (MoCA)-integrated BCM7125 and BCM7119 single-chip, multi-format HD DOCSIS® 2.0 compatible solutions usher in the next evolution of the connected home with advanced functionality and services such as multi-room HD DVR capabilities and advanced 3D graphics user interfaces.

Society of Cable Telecommunications Engineers (SCTE)

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