Agilent Intros Comms Wafer Tester

SAN JOSE, Calif. -- Agilent Technologies Inc. (NYSE:A) today announced a new series of parametric test solutions for optical communications, complex radio frequency (RF) semiconductors, optical communications semiconductors and metal-oxide semiconductor (MOS) wafers. The Agilent E5270 Series is the only integrated scalable parametric test solution to offer multiple configurations at a variety of price/performance points to cost-effectively address a wide range of test challenges. "The Agilent E5270 Series consolidates multiple capabilities into an integrated instrument family, enabling lower-cost, higher-performance parametric test solutions without associated integration issues," said Kenzo Ishiguro, parametric test business manager of Agilent's Hachioji Semiconductor Test Division. "Housing and effectively managing multiple SMUs in a single mainframe is the key to the E5270 Series' ability to perform advanced parametric tests without driving up the cost of test." The E5270 Series mixes a multi-SMU architecture with two selectable analog-to-digital converter (ADC) configurations, resulting in reduced test times and improved throughput. Each instrument contains a shared ADC, which can be used with all of the instrument's SMUs when high-precision measurements are required. Each of the instrument's individual SMUs also has its own dedicated ADC, which enables faster measurements and higher throughput rates. This selectable ADC architecture gives the E5270 Series unsurpassed versatility for a variety of parametric test needs. Agilent Technologies Inc.