Zarlink Semiconductor launches three low-density circuit emulation services (CES) over-packet processors
December 15, 2004
OTTAWA -- Zarlink Semiconductor (NYSE/TSX:ZL) today launched three low-density CES (Circuit Emulation Services)-over-Packet processors that allow network operators to cost-effectively support TDM voice, video and data services over expanding metro Ethernet and wireless networks.
The three-chip ZL(TM)50117 family utilizes CES-over-Packet technology to seamlessly "tunnel" one, two or four streams of TDM traffic, with associated timing and signaling, across Ethernet, IP (Internet Protocol) and MPLS (Multiprotocol Label Switching) networks. Complimenting Zarlink's ZL50120 family of fully featured low-density packet processors, these new devices allow service providers to easily deliver TDM legacy services to their customer.
"By adding Zarlink's CES-over-Packet expertise within a metro Ethernet network, service providers can cost-effectively carry highly profitable TDM traffic alongside packet-based services," said Jeremy Lewis, product line manager, Timing and Convergence, Zarlink Semiconductor. "Similarly, as wireless operators evolve towards an IP infrastructure, CES-over-Packet technology allows them to reduce operating costs and maintain services without requiring a significant infrastructure upgrade."
Zarlink Semiconductor Inc.
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