Wisair announces its first complete MBOA compliant chipset solution

October 20, 2004

1 Min Read

TEL AVIV -- Ultra Wide Band (UWB) chipsets and solutionsleader - Wisair announces the release of the 530 Baseband chip as part of a completechipset solution, complying with Multi-Band OFDM Alliance (MBOA) standards. Thechipset, a combination of the previously announced 501 SiGe RF chip and the new 530Baseband chip, demonstrates the company’s commitment to providing the industry with alow cost, high bit-rate UWB solution. Designed to support short range connectivity up to480 Mbps, the solution represents the fastest commercial wireless chipset to conform toMBOA standards.

The new 530 PHY Baseband chip comprises of a full Multiband OFDM modem based on0.13 micron CMOS technology, manufactured by TSMC. The 501 RF chip, launched sixmonths ago, has been integrated into Wisair’s Evaluation Tool Kit system (EVT) andshipped to partners and customers, following successful demonstrations at the SanFrancisco Intel Developer Forum (IDF, September 7-9, 2004). The chipset, successfullytested indoors, provides an over-the-air wireless link beyond 10 meters with wireless USBand wireless video applications.

“Wisair is the first company to provide an MBOA compliant chipset solution that cansuccessfully demonstrate a complete over-the-air wireless UWB link. Following its provenperformance, we believe the Wisair chipset solution will represent the preferred choice forcommercial use by most of the industry,” said David Yaish, Wisair President and CEO.

“The new Wisair chipset solution together with our reference designs will accelerate thedevelopment of truly wireless high-data rate products by partners and renownedelectronic suppliers,” he added.

Wisair Ltd.

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