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The patented Optimate Fibershape process uses lasers to prepare fiber end-faces for termination in connector assemblies and optical devices
May 3, 2002
HARRISBURG, Pa. -- Tyco Electronics today announced that it has been awarded United States Patent No. 6,246,026 on the OPTIMATE FIBERSHAPE process, which uses the power of a laser beam to prepare fiber end-faces for termination in connector assemblies and optical devices. "By using a laser beam, the patented process realizes unprecedented accuracy and versatility in preparing fiber end-face configurations, and leap frogs traditional approaches of mechanically cleaving and polishing a fiber's end," explained Twan Hultermans, Global Product Manager, Tyco Electronics. With its ability to not only cut fiber accurately, but also shape fiber end faces, the OPTIMATE FIBERSHAPE process heralds new ways of terminating optical fibers and packaging optical components. Tyco Electronics began pioneering the concept of using a laser to cleave and shape fiber end faces a number of years ago in Holland. Over the years, the concept has been borne out and now Tyco Electronics has established the OPTIMATE FIBERSHAPE process as a sound and commercially viable means of preparing fibers for termination in connector assemblies and optical packages. Tyco International Ltd.
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