TeleCIS Raises $10M

WiMax chip developer TeleCIS Wireless raises $10M in Series C funding

January 19, 2006

1 Min Read

SANTA CLARA, Calif. -- TeleCIS Wireless, Inc., a leading developer of WiMAX fixed, portable and mobile broadband wireless chipset technology, today announced the company has secured $10M in Series C funding, bringing the company's total funding to $18.7 million, excluding product revenues from its WiFi designs. The Series C round was co-led by ATA Ventures of Redwood City, California and an undisclosed strategic corporate investor. This round of funding will support the upcoming launch of the company's performance leading WiMAX Fixed/Portable subscriber device chip as well as the development of the second TeleCIS chip, a multi-protocol chipset combining 802.16e WiMAX Mobile and 802.11 WiFi protocols in a single chip.

"We are pleased to have the continued involvement of ATA Ventures as well as the addition of an industry leading communications company to our Board," said Sam Endy, CEO of TeleCIS Wireless. "This financing round combines venture and strategic resources which should provide valuable insight into the market as we move forward."

"We believe WiMAX is poised to become a leading broadband wireless technology and the TeleCIS market strategy and chip designs for both portable and mobile WiMAX devices are a generation ahead of the pack," said Hatch Graham, Managing Director of ATA Ventures.

The company's first chip, TCW 1620, is fully compliant with the 802.16-2004 WiMAX Fixed standard and incorporates the TeleCIS performance enhancing techniques, Rx Technologies(TM), to lead the industry in performance, low power consumption and small footprint. The chip is designed for both fixed indoor consumer premises equipment as well as portable subscriber devices such as PC Cards and small form factor portable access products for laptops and PDAs.

TeleCIS Wireless Inc.

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