Qualcomm Supports CDMA2000 1X

BANGKOK, Thailand -- QUALCOMM Incorporated, pioneer and world leader of Code Division Multiple Access (CDMA) digital wireless technology, today announced a fully integrated radioOne(TM) Zero Intermediate Frequency (ZIF) solution for CDMA2000 1X in the 450 MHz frequency band. QUALCOMM's latest radioOne chips, the RFR6175(TM) receive and RFT6170(TM) transmit RF IC chips, combine with QUALCOMM's MSM6025(TM) Mobile Station Modem(TM) (MSM(TM)) chipset and system software solution and the advanced power management PM6050(TM) device and system software. This complete solution is specifically targeted to serve emerging markets supporting Band Class 5, the 450 MHz frequency band. Samples of the RFR6175 and the RFT6170 chips supporting the MSM6025 chipset are expected to ship in December 2003.

"QUALCOMM has been supporting the 450 MHz frequency band starting with our MSM5xxx family of chipsets," said Dr. Sanjay Jha, president of QUALCOMM CDMA Technologies. "We are continuing this support by introducing our RF ZIF products -- the RFR6175 and the RFT6170 -- enabling smaller form factors and bringing a cost-effective solution to manufacturers supporting these important emerging markets."

All solutions in the MSM6xxx chipset family are based on radioOne Zero Intermediate Frequency (ZIF) architecture, providing reduced bill-of-material (BOM) costs and ultimately more cost-effective solutions for CDMA2000 wireless devices. The RFR6175 chip is offered in a 6mm x 6mm, 40-pin, Quad Flat No- Lead (40QFN) package and the RFT6170 chip is offered in a 5mm x 5mm, 32QFN package.

The addition of the MSM6025 chipset to the CDMA2000 1X MSM portfolio complements QUALCOMM's extensive and fully segmented line of entry-, mid- and high-tier solutions. Specifically targeted to enable broad availability of data devices and services in newer CDMA2000 1X markets, the MSM6025 chipset solution delivers 153 kbps data for entry-level products. The MSM6025 chipset and system software also offers increased processing power and flexible memory interface capabilities to utilize cost-effective external memories for the lowest system cost.

Qualcomm Inc.