PMC-Sierra introduces new HDLC packet processors and high-density T1/E1 framers for converged IP networks

October 24, 2005

3 Min Read

SANTA CLARA, Calif. -- PMC-Sierra, Inc. (Nasdaq:PMCS - News) today announced the PM7305 FREEDM 336LE, PM7306 FREEDM 84LE,PM7307 FREEDM 32LE and PM8312 TEMUX 32 devices, the newest members of its market-leading FREEDM(TM) family of HDLC packet processors and TEMUX® family of high-density T1/E1 framers, mappers and multiplexers for multi-service architectures. The FREEDM LE devices add Multilink Point-to-Point Protocol over Frame Relay to the industry's only family of production-released HDLC, Point-to Point Protocol and Frame Relay processors that feature reliable, hardware-based processing for Multilink-PPP (ML-PPP) and Multilink-FR (ML-FR). The scalable TEMUX 32 reduces overall design costs and time to market for new designs by enabling a single development effort that targets rates ranging from T1/E1 up to OC-12/STM-4. PMC-Sierra's FREEDM and TEMUX families play a fundamental role in supporting traditional TDM-based networks, while enabling the transition to a converged IP infrastructure.

"PMC-Sierra's FREEDM LE and TEMUX families are an integral part of our strategy to service the wireless and wireline infrastructure market with winning solutions for our customers," said Dino Bekis, vice president of marketing and applications for PMC Sierra's Communication Products Division. "Our customers need to deliver scalable, flexible and reliable systems that address the next generation of converged IP services. PMC-Sierra's field-proven FREEDM and TEMUX product lines set the industry standard and provide the lowest risk and most scalable, cost-effective solutions in the market."

PMC-Sierra's FREEDM LE family enables:

  • equipment manufacturers to deliver resilient router solutions that bridge the bandwidth gap between T1/E1 and DS3;

  • the management of high-priority traffic and large data packets for latency-sensitive applications such as VoIP; and

  • wireless networks to transition to an IP-based 3G network infrastructure, using Multilink Point-to-Point technology.

The TEMUX 32 integrates 32 T1/E1 framers, a DS3/E3 framer, an M13 multiplexer and a VT/TU mapper in a single device, featuring:

  • enhanced clock control and jitter performance required by 3G Wireless, TDM over Packet (PWE3) and Circuit Emulation applications; and

  • seamless interconnect with PMC-Sierra's Layer 2 solutions via the Scalable Bandwidth Interconnect (SBI) interface, reducing power, pin count and board design complexity compared to competitive devices.

The FREEDM LE and TEMUX devices are key components of an architecture that is critical to the growth in converged IP-based data and voice services, while leveraging the tremendous installed base of traditional Frame Relay- and PPP-based equipment. The FREEDM LE family and TEMUX 32 leverage field-proven technology to enable scalable and flexible next-generation architectures with minimum design risk and development cost. The devices are ideal for high density T1/E1 and DS3/E3 line cards in Wireless Radio Network Controllers (RNC), Base Station Controllers (BSC), Routers and Current and Next Generation Voice Infrastructure Equipment (see Figure 1).

Scalable and Feature-Rich Multi-Service Architectures

The FREEDM 336LE supports up to 336 T1, 252 E1 or 12 DS3/E3 links and is ideal for channelized OC-12/STM-4 or nxOC-3/STM-1 line card designs. The FREEDM 84LE supports up to 84 T1, 63 E1 or 3 DS3/E3 links and up to 1024 HDLC channels and is targeted at nxDS3 and OC-3/STM-1 line card designs. The FREEDM 32LE supports up to 32 T1/E1 or 1 DS3/E3 link and up to 1024 HDLC channels and is ideal for DS3/E3 or multiple T1/E1 line card designs. All members of the FREEDM LE family are hardware and software compatible, allowing one development to target multiple line card densities.

The TEMUX 32 device supports up to 32 T1, 32 E1 or 1 DS3/E3 link and features an M13 Multiplexer and VT/TU mapper. The device 32 features an SBI interface with enhanced clock control, enabling T1/E1 clock jitter and wander performance that meets rigid 3G wireless infrastructure, TDM over Packet (PWE3) and circuit emulation requirements. The integrated SBI bus reduces pin count and power consumption and enables a seamless interconnection to PMC-Sierra Layer 2 solutions, such as the new FREEDM LE family.

PMC-Sierra Inc.

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