East Fishkill, NY and Somerset, NJ, June 6, 2000 -- IBM and Multilink Technology Corporation (Multilink) today announced an agreement under which the two companies will jointly develop high speed components for data and telecommunications applications.

The two companies will work together to combine IBM's advanced silicon germanium (SiGe) and CMOS technologies with Multilink's expertise in the complete design and manufacture of integrated circuits, modules and subassembly boards used in communications. The work will involve joint development of components and reference designs for high speed 'transport layer' 10 and 40 Gigabit SONET (Synchronous Optical Network), SDH (Synchronous Digital Hierarchy) and Ethernet networks.

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