Engim Appoints VPs

ACTON, Mass. -- Engim, Inc., a leading developer of wireless LAN infrastructure silicon solutions, today announced the appointments of three key senior engineering executives: Rich Dauber as Vice President of Engineering, Dr. Amit Sinha as Vice President and Chief Technologist and Manish Bhardwaj as Vice President and Chief Architect and Nick Sargologos as Director of Product Marketing.

Rich Dauber, VP of Engineering, has more than 20 years of experience in development of silicon and complex digital, analog and RF components and systems. At Basis Communications, and then at Intel (NASDAQ: INTC) after their acquisition of Basis, Mr. Dauber led the development of advanced network processors including the IXP425 and IXP2800. Mr. Dauber’s experience also includes advanced RF systems engineering at Sanders and Raytheon (NYSE: RTN). Rich holds a BSEE from New York Institute of Technology. As VP of Engineering at Engim, Rich will be responsible for leading the development of Engim’s components and reference systems.

Dr. Amit Sinha, Engim’s Vice President and Chief Technologist, has been a key contributor to the development of Engim's core technology from its inception. He received his S.M. and Ph.D. degrees in Electrical Engineering and Computer Science from the Massachusetts Institute of Technology, Cambridge, and is the distinguished recipient of the President of India’s Gold Medal, having graduated summa cum laude in Electrical Engineering from the Indian Institute of Technology. He has authored over two dozen conference and journal papers based on innovations done during his tenure at MIT, Texas Instruments, Intel and Hewlett Packard. Dr. Sinha was the recipient of the Gordon Wu fellowship from Princeton as well as the Hewlett Foundation Fellowship from Berkeley. As Vice President and Chief Technologist, Amit will be responsible for driving key innovations and technology for Engim.

Manish Bhardwaj, Vice President and Chief Architect, has also been a key contributor to the architecture and definition of the EN-3000 hardware family. Prior to architecting Engim’s wideband and OFDM modems, he worked on ultra-low-power sensor networks at the Massachusetts Institute of Technology. He previously worked with Siemens Microelectronics (now Infineon (NYSE: IFX)), defining and creating digital line CODECs and application specific digital signal processors. Mr. Bhardwaj holds a B.A.Sc. with Honors from NTU, Singapore and an S.M from the Massachusetts Institute of Technology. He has published more than thirty research papers, book chapters and tutorial presentations. Mr. Bhardwaj, as Vice President and Chief Architect, will be responsible for driving next-generation product architecture and technology for Engim.

Director of Product Marketing Nick Sargologos has most recently led marketing teams responsible for 802.11 chipset strategy and ODM management at and Intersil (NASDAQ: ISIL) and Conexant (NASDAQ: CNXT). Mr. Sargologos is a seasoned marketing professional, with over 15 years experience managing broadband and wireless product development programs for industry leaders IBM (NYSE: IBM), Motorola (NYSE; MOT) and Dell (NASDAQ: DELL). Nick played a strategic role in the launch of Dell's "True Mobile" 802.11 products, and oversaw the global supply chain for all wireless products sold by Dell. He holds a B.S. From the University of Texas at Austin, and served for 8+ years as a pilot in the U.S. Navy.

Engim President and CEO Nick Finamore comments: “With these appointments, we have a complete leadership team at Engim. I am confident that these executives, together with Engim’s exceptionally talented and hard working employees, will enable us to achieve the highest levels of success.”

Engim Inc.