DiCon is announcing a new MEMS 24x24 Matrix Switch Module

February 27, 2006

2 Min Read

RICHMOND, Calif. -- DiCon Fiberoptics Inc., a leading manufacturer of fiberoptic components, modules, and test equipment, is announcing a new MEMS 24x24 Matrix Switch Module. The new module will be shown at OFC/NFOEC 2006, at the Anaheim Convention Center (March 7-9, 2006). The 24x24 Matrix Switch Module is based on DiCon’s MEMS 1x24 Optical Switch component. 48 of the MEMS 1x24 switch components are used in a fully non-blocking (strict sense) two-stage configuration. 24 MEMS 1x24 switches provide fan-out from the 24 input fibers, and are fully interconnected to 24 MEMS 24x1 switches that provide fan-in to the 24 output fibers. Each MEMS 1x24 switch is based on a micro-electro-mechanical system (MEMS) chip, as used in DiCon’s family of MEMS 1xN Switch components. Each MEMS chip consists of a “3D” electrically movable mirror on a silicon support. Voltages applied to the MEMS chip cause the mirror to rotate on two independent axes, which changes the coupling of light between a common fiber and 24 input/output fibers. The MEMS 1x24 Switch component features low insertion loss, low power consumption, excellent repeatability, C and L band operation, and an extremely compact form factor. It is a non-latching device that acts as a shutter when electrical power is removed.

The MEMS 24x24 Matrix Switch Module uses a new housing design that incorporates a modular fiber-tray design for reduced integration time and manufacturing cost. The module includes electronics to control the operation of each switch component, as well as the overall state of the switch matrix, over the customer’s choice of serial interfaces (I2C, RS232, or RS485). Evaluation software allows drag-and-drop set-up and tear-down of optical switch paths. Using discrete MEMS switches, the MEMS 24x24 Matrix Switch Module offers low insertion loss (< 1.5 dB), excellent return loss and crosstalk isolation, low power consumption (less than 500 mW), and support for high optical power levels (500 mW), compared to “free space” 3D MEMS switches. The module has a form factor of 260 mm x 200mm x 25mm (10.5” x 8” x 1”).

DiCon’s 1xN and MxN Optical Switch Modules can be implemented in a broad range of sizes and configurations, using varying quantities and types of MEMS 1xN switch components. Our modular housing design and use of module-level integration enables rapid development of custom configurations for Optical Cross-Connect (OXC) and optical switching functions, for telecom, defense, and other industrial and research applications. Additional functionality such as optical attenuation, power management and monitoring, multi-casting, and splitting/filtering can also be incorporated, at customer request.

DiCon Fiberoptics Inc.

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