IRVINE, Calif. -- ConnectCom MicroSystems, a developer of ultra high-speed communications chips for the optical networking industry, today announced the industry's first single chip, fully integrated, 10.66 Giga bit per second (Gbps) Forward Error Correction data rate transceiver. Fabricated in a production released, advanced silicon germanium process, its maximum power dissipation is only 1.6 Watts under fully loaded conditions. The IC, called the CC4502, establishes a new industry benchmark for high performance solutions at OC-192 FEC data rates. It is also incorporates a commercial, matched impedance plastic Flip-Chip Ball Grid Array (FCBGA) package, providing a 50 ohm transmission line from die to board.

ConnectCom achieved this dramatic advancement using a commercially available Silicon Germanium (SiGe) process technology. "We selected Infineon Technologies SiGe because of its superior device performance and track record in performance process technologies,” said Syed Enam, cofounder, Chairman and President. "In conjunction with our design technology, we provide an unparalleled combination of low power and high performance. Using SiGe, we are able to achieve industry leading low power consumption while maintaining generous design margins and improving performance. This will assist our customers in their manufacturing process by providing a more stable and resilient product."

ConnectCom MicroSystems Inc.