Amkor and PMC-Sierra collaborate on flip-chip packaging solutions

August 27, 2002

1 Min Read

CHANDLER, Ariz. and SANTA CLARA, Calif. -- Amkor Technology, Inc.(Nasdaq: AMKR), the world's largest provider of outsourced semiconductor assembly and test services, and PMC-Sierra (Nasdaq: PMCS), a leading provider of broadband semiconductors, today announced the release to production of second generation flip-chip packaging solutions. PMC-Sierra worked with Amkor engineers to define the packaging architectures that achieve lower power and smaller die size required for networking equipment. The new flip-chip packaging solutions are used in PMC-Sierra's 10 Gigabit Ethernet XENON(tm) family of devices and PMC-Sierra's OC-48 and OC-192 transport optimized CHESS-III(tm) chip set. With its superior signal integrity characteristics, reduced footprint and high current distribution capability, flip-chip packaging is ideally suited for the high speed processing demanded by ultra-high performance networking applications. The technology supports up to 258 3.125 Gigabit-per-second serial links. "Amkor is working closely with PMC-Sierra to develop flip-chip packaging solutions that support high performance applications, ranging from wireless base station equipment to large-scale networking systems," said Richard Groover, Amkor's vice president for flip chip technology. "We are also working together on a product roadmap that employs more advanced substrate technologies to further enhance the price / performance of flip-chip solutions." Amkor Technology Inc. PMC-Sierra Inc.

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