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Amkor, IBM Flip Chips

IBM announces next-gen Surface Laminar Circuit 'flip chip' packaging technology; Amkor and IBM to coordinate flip chip offerings

July 15, 2002

2 Min Read

EAST FISHKILL, N.Y. -- IBM today announced its second-generation Surface Laminar Circuit (SLC) "flip chip" packaging technology and collaborative efforts with Amkor Technologies, ASAT Holdings Limited and Advanced Semiconductor Engineering, Inc. to make the technology available for a broader set of customer applications. The new SLC packaging technology is designed to support higher performance and more complex chip designs. With growing customer demand for this technology, IBM is working with Amkor, ASAT and ASE to enable them to design, build and assemble modules using these new advanced flip chip substrates. IBM will support these assemblers by providing substrate design services as well as electrical, mechanical and thermal modeling, all to make the technology easier to use and more widely available for customers. "The transition to flip chip is accelerating," said Hal Lasky, director, Interconnect Products, IBM Microelectronics. "IBM's long-term experience in flip chip uniquely positions us to provide solutions for customers making that transition. Now our SLC technology is an option available to Amkor, ASAT and ASE customers as well." IBM intends to provide the new SLC substrates based on its "build up technology" currently manufactured in Yasu, Japan. ASAT plans to provide assembly services at various facilities in Asia, while AMKOR also plans to provide assembly services at various facilities in Asia (including Taiwan, Philippines and Korea). ASE plans to provide assembly services at various facilities in Asia as well. In a separate release: CHANDLER, Ariz. -- Amkor Technology and IBM have agreed to work together on the design and production of advanced Flip Chip substrates & packaging. IBM can provide front-end engineering services including electrical, thermal and mechanical modeling and substrate design, as well as their advanced Flip Chip substrates. These substrates include IBM's Build Up technology, currently manufactured in Yasu, Japan and IBM's MLC, manufactured in East Fishkill, NY. Amkor will provide Flip Chip design and assembly services at its various facilities in Asia, including Taiwan, China, Korea and the Philippines. Customers will be able to work directly with Amkor or IBM or both. This relationship should enable IBM to offer its flip chip substrate to more customers and allow Amkor to further enhance its leadership position in flip chip manufacturing and technology development. "IBM's expertise in design, characterization, and manufacturing of flip chip substrates, when allied with Amkor's flip chip packaging and assembly manufacturing capability, can provide the semiconductor industry with a powerful tool to facilitate the conversion to flip chip solutions," said Hal M. Lasky, IBM's Director, Interconnect Products Business Line. IBM Corp.Amkor Technology Inc.

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