FREMONT, Calif. -- AXT, Inc. (Nasdaq: AXTI), a leading manufacturer of compound semiconductor substrates and optoelectronic devices, today announced the availability of its 780nm and 850nm vertical cavity surface-emitting laser (VCSEL) wafers. These wafers are available in two types: one is suitable for ion-implantation processes and the other for oxidation processes. Because these wafers have a thickness variation of less than 0.5 percent, the wafers are ideally suited for one-dimensional and two-dimensional VCSEL arrays for applications such as Gigabit Ethernet, Storage-Area Networks, laser printers, high-speed optical input/output and wavelength division multiplexing (WDM).

"AXT's state-of-the-art MOCVD systems use a monitoring and control process that allows us to grow the very complex and demanding VCSEL structure uniformly, consistently and with higher yields," said Morris Young, president and CEO. "Our new VCSEL wafers demonstrate AXT's commitment to providing our customers the highest quality products that meet strenuous requirements for high-speed data transmission."

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