Intel Expands Wares
The Intel NetStructure® MPCBL0050 Single Board Computer is the first AdvancedTCA* (ATCA) blade server based on the Intel® Core™ microarchitecture. Also unveiled today were the new power-efficient Dual-Core Intel® Xeon® processor LV 5138 and LV 5128. These new products are well suited for compute-intensive and space-constrained environments such as telecommunications central offices and datacenters. The fourth product announced is the Intel® Carrier Grade Server TIGW1U, powered by previously launched Dual-Core Intel® Xeon® processor LV 5148, which offers customers high performance per watt in a small ruggedized form factor.
“Today’s new products, based on the revolutionary Intel® Core™ microarchitecture, expands the Intel portfolio of modular communications building blocks and turbo charges Moore’s Law for communications,” said Anthony Ambrose, general manager, Intel Modular Communications Platform Division. “Intel now offers the broadest choice of high-performance, standards-based building blocks for communication servers with the price and feature flexibility equipment manufacturers require.”
The Intel NetStructure MPCBL0050 blade server, powered by the new Dual-Core Intel Xeon processor LV 5138, delivers almost three times the performance per slot of the leading competitive blade server, which enables service providers to deliver new, revenue-generating services with fewer blades. It runs Carrier Grade Linux* operating system and offers significant performance improvements for compute-intensive and database-access applications, including IP Multimedia Subsystems (IMS), wireless control plane and IPTV. Additionally, it is designed to be the first blade server to comply with the proposed Communications Platforms Trade Association (CP-TA) 1.0 standard to improve industry interoperability.
The Dual-Core Intel Xeon processor LV 5138 and 5128 combine the benefits of a dual-core processing with dual-processor capabilities, providing four high-performance cores on a single platform. The LV 5138 offers telecommunication customers robust thermal profiles and a low Thermal Design Power (TDP) for solutions that require compliance with ATCA form factor and NEBS Level-3 thermal specifications.
“HP works closely with Intel to incorporate the latest high-performance ATCA processor blade technology into comprehensive solutions that include hardware, software and worldwide services and support,” said Stephen Low, marketing director, carrier grade platforms, Business Critical Systems, HP. “With solutions based on ATCA blade servers such as the HP bh5700 series, HP can give its customers a time-to-market advantage.”
“Motorola is committed to adopting multi-core technology such as the Intel NetStructure MPCBL0050 Single Board Computer in our Centellis*™ and Avantellis*™ series AdvancedTCA* servers as it will enable us to deliver more cost-effective and energy-efficient solutions to meet network equipment provider requirements for compute-intensive applications,” said Wade Campbell, senior director, Strategic Marketing for Motorola’s Embedded Communications Computing business. “We believe this technology will allow us to increase the capacity on existing applications and will enable our industry-leading communications servers to address a broader range of next-generation applications.”
Intel Corp. (Nasdaq: INTC)