Cadence Enables Innofidei TD-LTE Chip

Chinese chipmaker's TD-LTE design achieved first-pass silicon success in tight collaboration with Cadence Global Services

June 21, 2010

1 Min Read

SAN JOSE, Calif. -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that Innofidei Inc., a leading mobile chipset provider based in Beijing, China, has successfully taped out the industry's first long-term evolution time division duplex (LTE-TDD, or TD-LTE) baseband chip supporting a bandwidth of 20MHz for the next-generation TD-CDMA wireless communications protocol. The TD-LTE design achieved first-pass silicon success in tight collaboration with Cadence® Global Services. Working with the Innofidei team, Cadence delivered netlist-to-GDSII implementation in a record four months turnaround time, helping Innofidei tighten the productivity gap as outlined in the EDA360 vision.

Founded in Beijing Z-Park in 2006 with operations in Beijing, Silicon Valley and Taipei, Innofidei dedicates itself to providing IC and system solutions for the mobile TV and wireless communication markets. Innofidei's 65-nanometer, low-power SoC is integrated into a mobile terminal system successfully tested by China Mobile Communications Corporation and is being demonstrated at EXPO Shanghai 2010.

"The fast, flexible and comprehensive design capabilities offered by Cadence Global Services minimized our risk and became a vital enabler for the first-time-right completion of this design. This process was all completed within a very aggressive schedule and with the most challenging design targets," said Tom Zhang, chief executive officer at Innofidei. "We were extremely satisfied with the technical knowledge, flexibility and dedication of the Cadence Global Services team, who worked with us as if we were one company."

Cadence Design Systems Inc.

Innofidei Inc.

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