TE Connectivity Shows Off Small Cell Innovations
BARCELONA -- TE Connectivity (TE), a world leader in connectivity, today announced that it will display a range of distributed antenna systems (DAS) and optical infrastructure solutions in booth 6B52 at the Mobile World Congress show in Barcelona this week. These industry-leading solutions make deploying small cell networks easier and more cost-effective. Among the innovations to be showcased in the main booth area are the TE powered fibre cable system that slashes the cost and time of small cell deployments and a CPRI interface to TE’s FlexWave digital DAS products. Among the solutions to be featured inside the booth’s Innovation Centre, TE will display an InterReach Fusion DAS with MIMO capabilities, the new active integration panel (AIP) that significantly reduces the space, power and costs of DAS head-end deployment, as well as the latest TE low power Ethernet cable-based DAS solutions.
TE’s DAS and optical infrastructure solutions continually drive down the cost and effort of deploying next-generation wireless networks. For example:
The TE powered fibre cable system combines power and optical communications into one system. It eliminates the complexity of small cell installation, allowing small cell devices to be placed wherever they are needed for maximum 4G wireless coverage. The system incorporates everything needed to power and communicate with a small cell – including the power supply, a hybrid cable, and a remote powering unit that corrects for DC line loss to eliminate the need for electrical design engineering calculations.
TE Connectivity (NYSE: TEL)