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HiSilicon Unveils Multimode LTE Chips

Light Reading
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Light Reading
3/8/2012
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BARCELONA -- HiSilicon today released Balong 710 - the world’s first multi-mode chipset supporting 3GPP Release 9 and LTE Category 4 at the GTI (Global TD-LTE Initiative) at MWC 2012.

Highlights of Balong 710’s features are as follows:

  • LTE FDD mode : 150Mbit/s downlink and 50Mbit/s uplink
  • TD-LTE mode: Up to 112Mbit/s downlink and up to 30Mbit/s uplink
  • WCDMA Dual Carrier with MIMO: 84Mbit/s downlink and 23Mbit/s uplink
  • Dual-Layer beamforming technology that can significantly improve average throughput, especially at the edge of cell


“TD-LTE has become one of the core drivers of LTE development globally and HiSilicon has committed to invest in terminal chipset solutions for years, which can support both TD-LTE and FDD-LTE,” said Eric Xu, Chairman of HiSilicon Technologies. “Going forward, HiSilicon will deliver more powerful chipset solutions for smartphones and tablets through innovation based on the needs of operators and consumers, to improve user experience and user perception.”

HiSilicon Technologies Co. Ltd.

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