 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
 |
|
 |
|
 |
|
|
|
|
|
|
Please contact:
Jeff Claudino
Director of Sales, Insider Research Services
619-229-9940
or via email at:
claudino@lightreading.com |
|
|
|
|
|
 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| more news |
|
 |
|
|
|
| A TELECOMMUNICATIONS RESEARCH SERVICE |
|
|
| A CABLE/MSO SECTOR RESEARCH SERVICE |
|
|
| A BUSINESS-CLASS VOICE APPLICATIONS RESEARCH SERVICE |
|
|
| A SERVICE DELIVERY RESEARCH SERVICE |
|
|
|
| A WIRELESS INFRASTRUCTURE RESEARCH SERVICE |
|
|
| REAL WORLD RESEARCH |
|
|
|
|
|
|
|
|
|
|
|
|
 |
|
|
| MicroTCA: Ready for Prime Time |
|
After a short delay, MicroTCA is now set to follow Advanced Telecom Computing Architecture (ATCA) into mainstream adoption. By using MicroTCA, system manufacturers can significantly reduce the development cost and time to market for medium- and high-volume applications. Production-ready MicroTCA systems have been available for more than two years, and the cost of components and systems is dropping with integrated solutions and cost-optimized designs.
MicroTCA systems use the Advanced Mezzanine Card (AMC) developed for ATCA systems. These flexible modules fit in a range of platforms, including ATCA, MicroTCA, blade server, and proprietary systems. Available AMC modules include general-purpose and network processors, digital signal processors (DSPs), as well as storage and networking input/output (I/O). The modules needed for most MicroTCA applications are readily available from multiple vendors.
MicroTCA was developed by the PCI Industrial Computer Manufacturers Group (PICMG) as both a complementary platform to ATCA and a cost-effective common platform for medium-volume applications across several industries. MicroTCA systems are significantly smaller than ATCA systems and can be configured for many different packaging options, including 19-inch racks, standalone boxes, and ruggedized chassis. The MicroTCA Rev. 1.0 specification was ratified in July 2006, and the first production-ready systems were announced in early 2007.
There is already significant interest in MicroTCA from telecom equipment providers, and this is being matched by interest from the military and other sectors. Communications is a common theme of most initial MicroTCA applications; standard building blocks, including general-purpose processor AMCs and DSP-based AMCs, are used across telecom, military, and other markets.
The wide range of available MicroTCA systems fit into three classes: development systems, standard systems, and integrated systems. Most of the vendors covered in this report will also supply customized MicroTCA systems to meet specific customer requirements.
MicroTCA is set for significant growth over the next one to two years. The vendors that are successful will be those that deliver the right tradeoffs in terms of cost, performance, and availability, across the huge range of applications that can fit within a MicroTCA platform.
This report details and analyzes MicroTCA architecture and AMC connectivity, identifying the key advantages these technologies hold for equipment manufacturers. It also surveys system and component availability and profiles leading vendors in this expanding market.
|
|
|
|
|
|
|
|
|
|
|
|
|
|
 |
|
|
|
| Sample research data from the report is shown in the excerpts below: |
|
 Table of Contents (cci0609toc.pdf) |
|
| MicroTCA uses many of the technologies developed for ATCA, including AMC modules and Intelligent Platform Management Interface (IPMI)-based system management. The excerpt below shows the MicroTCA system management. At its core is the MicroTCA Carrier Management Controller (MCMC) located on each MicroTCA Carrier Hub (MCH) module. The MCMC manages the system resources, including cooling units, power modules, and AMC modules. Each AMC module contains a Module Management Controller (MMC), which is connected to the MCMCs via the Intelligent Platform Management Bus (IMPB). The cooling and power modules are controlled through the Enhanced Module Management Controller (EMMC) on each module. |
|
 |
|
| [click on the image above for the full excerpt] |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
 Companies profiled in this report include: Advantech Co. Ltd. (Taidex: 2395); Armvida, LLC; Comtel Electronics GmbH; Concurrent Technologies plc (London AIM: CNC); CorEdge Networks Inc.; Elma Electronic AG (Zürich: ELMN); Emerson Electric Co. (NYSE: EMR); Gateware Communications GmbH; GE Fanuc Embedded Systems Inc., a unit of GE Fanuc Automation Inc., a joint venture of General Electric Co. (NYSE: GE) and Fanuc Ltd. (Pink Sheets: FANUY); Kaparel Corp.; Kontron AG (Pink Sheets: KOTRF; Deutsche Börse: KBC); Mercury Computer Systems Inc. (Nasdaq: MRCY); MicroBlade, LLC; Netzwerk- und Automatisierungs-Technologie GmbH (N.A.T.); Network Engines, Inc. (NEI) (Nasdaq: NENG); Performance Technologies Inc. (Nasdaq: PTIX); Schroff GmbH, a subsidiary of Pentair Inc. (NYSE: PNR); Systems Industrie Electronics, AG; and VadaTech, Inc. |
|
| Total pages: 24 |
|
|
  |
|
|
|
|
 |
|
|
|
|
|
|
 |
|
|
|
|
|
| AUGUST 2009 |
 Blade servers for Telecom |
|
| OCTOBER 2009 |
| The latest PON Technology and Components |
|
| DECEMBER 2009 |
| 10GE Components survey |
|
| * Calendar subject to change |
|
|
|
|
|
|
|
