Presented as the industry's smallest quad 10GBASE-T PHY, the second-generation 40nm 10GBASE-T PHY delivers 50 percent lower power in the industry's smallest footprint to enable next-generation 10GBASE-T top-of-rack switch platforms, according to the company. Designed as a companion device to the StrataXGS Trident Switch Series, the highly integrated BCM84848 PHY allows OEMs to implement top-of-rack switches with 48 ports of 10GBASE-T and four 40 Gigabit Ethernet (GbE) QSFP uplinks while maintaining minimal depth of the platform, thus avoiding the dual row layout required with larger PHY packages. The package has a footprint of 23 x 23mm.
Calient Technologies Inc.
Application programming interface (API) for OpenFlow
An addition to the S320 optical circuit switch, together with an OpenFlow controller, the new API allows the S320 to reconfigure datacenter networks to optimize high-capacity data flows at the optical layer and to function as part of an integrated packet-circuit switched software-defined network (SDN).
Extreme Networks Inc.
BlackDiamond X8 High-Density XL 100GbE and 40 GbE switch modules
For data centers and to support new SDN applications, these modules help to scale the network for a variety of highly virtualized multitenant cloud data centers, Internet Exchange Points (IXPs) and data center core deployments. The new 4-port 100GbE and 12-port 40GbE modules offer nonblocking, wire-speed performance of Layer 2/3 services, Layer 2/3 ACLs and flow flexibility with support for 100G-SR (100m) and 100G-OR (10km) optics, a boost in scale of tables supported via an upgraded TCAM, and fault tolerance and redundancy with N+1 power support.
Overture Networks Inc.
Overture 1400 Carrier Ethernet edge platform enhancements
These include a 3-port DS3 interface module and software enhancements. The 3-port DS3 linecard supports Generic Framing Procedure (GFP) and Virtual Concatenation (VCAT) bonding using Link Capacity Adjustment Scheme (LCAS). The 3xDS3 module is supported by Overture's Release 12.1, which introduces additional performance enhancements and upgrades, including: (a) Dynamic p-bit remarking -- allows traffic that exceeds the committed information rate (excess information rate or EIR) to be marked with a priority bit valued for special handling by upstream networks; (b) Zero-touch provisioning -- allows the Overture 1400 to be installed at the customer site and automatically configured remotely with no local on-site intervention; (c) Y.1731 synthetic frame loss (ETH-SLM) -- provides accurate one-way measurements of frame loss by injecting specialized test traffic alongside live user traffic; (d) MLPPP support on the existing 8-port T1/E1 interface module -- provides an alternative industry-standard encapsulation and bonding technique for use with edge routers and aggregation switches; previously, the module supported only GFP encapsulation with PDH-VCAT bonding.
RAD Data Communications Ltd.
Micro Network Interface Device (MiNID)
The Ethernet-demarcation SFP form-factor solution plugs into the SFP cage of a manufacturer's host unit, so that, when an SFP device is inserted into the sleeve, it is transformed into a carrier-Ethernet demarcation and SLA verification device for remote service monitoring and fault isolation. Its compact size makes the MiNID suitable for small-cell backhaul applications, as well as virtual private networks and carrier-wholesale provider network termination. According to the company, the solution works with any SFP unit, made by any manufacturer. The same MiNID can be used with various fiber types (single mode, multimode, and also electrical SFPs) and up to distances of 10/40/80km, depending on the SFP. Also, it fits SFPs already installed in existing equipment.
Vitesse Semiconductor Corp.
The six-port Serval Lite switch engine is presented as the industry's first Ethernet-optimized networking solution for 4G/LTE small cells. The company says that this latest Serval device is optimized for small-cell applications, delivering rich carrier-Ethernet features at 75 percent lower power and 50 percent lower bill-of-materials cost than competing options.
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