AUSTIN, Texas -- Applauding the efforts of market leaders Freescale Semiconductor, Inc., Texas Instruments Incorporated, Tundra Semiconductor Corporation, and Xilinx, Inc. (NASDAQ: XLNX), The RapidIO Trade Association hailed the group’s demonstration of first-level interoperability testing. This interoperability work is a critical milestone that will help further deployment of RapidIO technology-based systems in a wide range of applications including the wireless infrastructure, edge networking, storage, scientific, military and industrial markets. The interoperability tests build on the trade association’s RapidIO Interconnect Specification Device Interoperability and Compliance Checklists, 1.3 Spec, which was developed for ecosystem members as a guide in developing their products.

“Working as a team, RapidIO ecosystem members have delivered a clear and powerful message: market leaders are determined to ensure the tools needed for OEMs to create and build systems leveraging the wide range of RapidIO products on the market are readily available,” said Tom Cox, executive director of the RapidIO Trade Association. “This leadership and commitment is evident not only of the group working on these tests, but of the entire RapidIO Trade Association membership.”

According to the team involved in the project, technology experts created multiple levels of Interoperability checklist items. The first level of device interoperability tests ensures “Device A” is proven to pass a given test with “Device B.” The subsequent group of checklist items focuses on RapidIO Specification compliance. Building on this work, the team’s long-term goal is to partition device interoperability and specification compliance tests into multiple levels of tests, each building off of the other.

RapidIO Trade Association (RIO)