HOD HASHARON, Israel -- Altair Semiconductor (http://www.altair-semi.com), a leading developer of ultra-low power, small footprint and high performance 4G LTE chipsets, today announced that its FourGee-3100/6200 chipset successfully completed TD/FDD LTE live handover testing with Rohde & Schwarz, the leading global manufacturer of wireless communications and EMC test and measurement equipment. The test, which employed Altair’s FourGee™ chipset in an end-user device, successfully enabled seamless communication between different LTE modes, achieving an uninterrupted and continuous data session with low handover latency from a 20MHz TD-LTE channel and a 10MHz FDD channel and back.

The two companies are presenting a joint demo of their handover capabilities at the Global TD-LTE Initiative (GTI) Asia Conference on June 18-20th in China.

“The ramifications of live LTE handover are major, addressing one of the LTE industry’s most desired goals – harmonization of all standard variants. Our baseband portfolio, complemented by our multiband radio chipsets, offer the market's most flexible and global solution," said Eran Eshed, Co-Founder and VP of Marketing at Altair Semiconductor. “Since introducing the industry's first LTE chipset in 2009, Altair has consistently been first to market with introducing numerous important LTE features.”

Altair Semiconductor